Plus heat molding instructions electronic potting HY 9055 

 First, the product features and applications 
 HY 9055 is a low viscosity two-component fire retardant silicone molding plus thermal encapsulants, room temperature curing can also be heat cured, has a higher temperature the faster curing characteristics. Hold heat when curing, non-corrosive, does not produce any by-products, can be applied to PC (Poly-carbonate), PP, ABS, PVC and other materials and metal surfaces. Insulation for electronic components, waterproof mold dust, fixed components, chemical resistance, yellowing resistance, resistance to weather aging. Fully comply with EU ROHS directive. 

 Second, the typical use 
 - High-power electronic components 
 - Cooling and temperature requirements of high power modules and the encapsulation protection circuit board 

 Third, the use of technology: 
 1 mixture, first the A component and B component in their respective containers to mix evenly. 
 (2) mixed, shall comply with Part A: B = 1:1 weight ratio of components. 
 3. HY 9055 when used according to the need for deaeration. To the A, B Stir mixture into the vacuum container, at 0.08MPa deaeration under 5 minutes, you can use the infusion. 
 4 should be in the technical parameters before and after curing temperature given in the table above, to maintain the appropriate curing time, if applied thicker, curing time may be exceeded. Room temperature or heat cure can be. Curing speed is affected by curing temperature, in the winter take a long time to cure, recommended heating curing, 80 ~ 100 ℃ curing 15 minutes at room temperature curing will normally take about eight hours. 

 !! The following substances may impede the curing of the product, or the occurrence of the phenomenon is not cured, so it is best applied after making simple experimental verification, if necessary, needs cleaning application site. 
 .. Is not fully cured silicone condensation-type 
 .. Amine (amine) curing epoxy resin 
 .. Ash soldering (solder flux) 

 Fourth, the technical parameters before and after curing: 
 Performance indicators 
 A component 
 Part B 

 Solid 
 Of 
 Before 
 Exterior 
 Dark gray fluid 
 White fluid 

 Viscosity (cps) 
 2500 ± 500 
 2500 ± 500 

 Exercise 
 Make 
 Sex 
 Can 
 Component A: B component (weight ratio) 
 1:1 

 Mixed Viscosity (cps) 
 2000 to 3000 

 Operational time (min) 
 120 

 Curing time (min, room temperature) 
 480 

 Curing time (min, 80 ℃) 
 20 

 Solid 
 Of 
 After 
 Hardness (shore A) 
 55 ± 5 

 Thermal conductivity [W (m · K)] 
 ≥ 0.8 

 Dielectric Strength (kV / mm) 
 ≥ 25 

 Dielectric constant (1.2MHz) 
 3.0 to 3.3 

 Volume resistivity (Ω · cm) 
 ≥ 1.0 × 1016 

 Linear expansion coefficient [m / (m · K)] 
 ≤ 2.2 × 10-4 

 Flame retardant 
 94-V1 

 The above performance data are at 25 ℃, relative humidity of 55% measured after 1 day curing. The test conditions are different companies or products to improve the data caused by different non-responsible. 

 V. Notes: 
 1, the compound should be stored. Mixture should be a good run out of rubber, to avoid wastage. 
 2, this product is non-dangerous goods, but not to the entrance and eyes. 
 3, stored for some time, plastic may be layered. Please stir well before use, does not affect performance. 
 4, the glue will make contact with these chemicals is not cured 9055,9060: 
 1) organic tin and organotin compounds in silicone rubber. 
 2), sulfide, and sulfur-containing rubber and other materials. 
 3) amines and amine-containing materials. 
 In the course, please pay attention to avoid the above-mentioned substances. 
 Six, packaging specifications: 
 HY 9060:20 Kg / sets. (A component 10Kg + B components 10Kg) 
 Seven, storage and transportation: 
 1 The product of the storage period of 1 year (25 ℃ or less). 
 (2) such products are non-dangerous goods, according to the general chemicals. 
 3 over the product shelf life should be recognized before any abnormal use. 


 Shenzhen Factory Address: Town, Longgang District, Shenzhen Ping Shek Pik Six Joint Industrial Zone Contact: Liao Zhongying 
 E-mail: hyw@szrl.net Mobile: 15889404068 
 Tel -755-89948019 Fax :86 -755-89948030